IC package industry including the pre-fabrication process and the post-chip packaging and testing process.
XMINNOV will attend RFID & Wireless IOT Tomorrow 2020
XMINNOV will participate in the China-UAE Economic and Trade Digital Exhibition
RFID JOURNAL LIVE 2020 FLORIDA
XMINNON will attend RFID & Wireless IOT tomorrow 2019
Xminnov Attends the 2019 RFID Journal Live In Phoenix